Likopo tse tloaelehileng:
Tlhahlobo ea semiconductor– Tlhahlobo ea wafer e ka morao, tekanyo ea TSV (ka silicon), tlhahlobo ea sekoli kamora ho seha ka laser
Tlhahlobo ea ho hloleha– Ho etsa ditshwantsho tse sa senyeheng ka di-substrate tsa silicon ho hlahloba meaho e patilweng
Ho sebetsana le laser– Ho shebella ka nako ea sebele ha ho tlosoa ha laser ea fiber ea 1064 nm, ho cheka, kapa ho tjheseletsa saenseng ea thepa le tlhahiso.
Saense ea tšepe le thepa– Tlhahlobo e phahameng ea libaka tse amehileng ke mocheso oa laser, likarolo tse nchafalitsoeng le meaho e menyenyane
Microscopy ea khanya ea NIR– Bakeng sa disampole tsa baeloji kapa tsa thepa tse hlokang ho sisinyeha ho haufi le infrared